Signal Integrity Issues Reduction In PCB Using Metamaterial

  • Fahad Bilal, Faheem Ansari, Siddiqui Ahmed Mohsin, Shah Awais, Ashfaque Ahmed

Abstract

High-speed circuit design has become a very popular industry in the development of electronic technology. Data Transfer at high speed raises many signal integrity issues. Metamaterial (EBG) is used to reduce the signal integrity issues. In this paper, two-dimensional electro- magnetic bandgap structure is proposed to reduce the noises in printed circuit board. Results & validation checks the reliability of 2D EBG for noise mitigation and the upgrade in the signal quality. Evaluate result in the form of transmission parameter S21 -86.49 dB (Loss of signal), surface current Distribution and bandwidth of 1.48 GHz. Also proposed the design of multilayer printed circuit board with metamaterial.

Published
2020-06-04
How to Cite
Fahad Bilal, Faheem Ansari, Siddiqui Ahmed Mohsin, Shah Awais, Ashfaque Ahmed. (2020). Signal Integrity Issues Reduction In PCB Using Metamaterial. International Journal of Advanced Science and Technology, 29(9s), 7594-7601. Retrieved from https://sersc.org/journals/index.php/IJAST/article/view/24524